Monday Mar 24, 2008

Latest from Labs and Microelectronics: Using Proximity and Lasers to Stitch Together a Macrochip

Today Sun announced a deal with the Defense Advanced Research Projects Agency (DARPA) to develop microchip interconnectivity via on-chip optical networks enabled by silicon photonics and proximity communication.  Translation: It's like a supercomputer on a chip.

This technology will allow applications like energy exploration, biotechnology and weather modeling to be accomplished with less power use and less expensive investment in silicon.

The contract with DARPA extends for five and a half years, with more than $44M of funding coming to Sun.  

John Markoff of the New York Times covered it in today's edition.  Check out his article here.

 

 

Tuesday Aug 14, 2007

Small Chip, Big Launch

I'm just resurfacing after the launch of our UltraSPARC T2 processor—aka, the world's fastest chip, aka, Niagara 2. It was a great success with coverage in well over 100 articles and reports worldwide. Here are a few resources for anyone interested in more information:

Webcast of the live launch event

Jonathan Schwartz's first blog about the launch

Jonathan Schwartz's second blog about the launch

Press release

Online press kit

Microelectronics home page

UltraSPARC T2 product page

OpenSPARC community page

Hope this helps!

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